There are different types of PCB materials. Allow us to introduce those that we are commonly supporting:
FR4

- FR4 (Flame Retardant) is a Glass Fiber epoxy laminate.
- It is the most commonly used PCB material 1.6mm.
- FR4 uses 8 layer of Glass Fiber material.
- The maximum ambient temperature is between 120 ̊C & 130 ̊C, depending on thickness.
Flexible Circuit

- Is typically a composite, less than 0.01inchs thick of metal foil conductors and a flexible dielectric substance.
- Conductors are usually banded to the dielectric with an adhesive.
- Conductors are often protected by conductive & insulative coating.
Metal Core

- Aluminum is the material used for metal core PCB.
- Is very effective to achieve heat conduction from the PCB. (So that, heat sinks can be replaced).
- Shielding effect from electro-magnetic field (e.g. to reduce induction of HF fields to PCB circuit) and strong structural strength (to increase the mechanical stability for cases, when PCB is impacted to vibrations).
CEM-3

- CEM-3 (Composite Epoxy Material) is very similar to FR4.
- Instead of woven Glass Fabric a “flies” type is used.
- CEM-3 has milky white color and is very smooth.
- Excellent PTH reliability equivalent to FR4
- Electrical properties equivalent to FR4
Roger
- Excellent high frequency performance due to low dielectric tolerance & loss.
- Good heat resistance and moisture resistance, lower warpage, good mechanical properties and electrical properties.
- Stable electrical properties versus frequency.
- Low thermal coefficient of dielectric constant.
- Excellent dimensional stability.
- Volume manufacturing process.
S1170

- S1170 suitable for high-count layer PCB.
- Widely used in computer, communication equipment, precise apparatus and instrument, router, and etc.
- High Tg 170 ̊C (DSC)
- Excellent thermal stability.
- Excellent anti-CAF performance.
- Low water absorption.
CEM-1

- CEM-1 most commonly used material for domestic single sided PCBs.
- CEM-1 is a paper-based laminate with one layer of woven Glass Fabric.
- CEM 1 has very good flatness, thermal resistance, and dimensional stability.
- CEM-1 is not suitable for Plate-Through-Hole (PTH).
- CEM1 can only be used for one-layer PCB.
BT RESIN

- BT Resin (Bismaleimide-Triazine resin) is the mixture of Bismaleimide, which as such is also used a raw material of PCB’s and Cyanate Ester.
- Product with very high glass transition temperature(Tg)- up to 300 degree C – and very low dielectric constant can be obtained.
- These properties make these materials very attractive for use in PCB’s.
In Metal Core PCB have ability to recycle and that is the reason to chosen mcpcb in electronic companies.
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