Hot Air Solder Leveling(HASL)

HASL is an acronym that stands for Hot Air Solder Leveling, a type of finish for printed circuit boards (PCB).
Immersion Gold (ENIG)
ENIG is a surface plating used for printed circuit boards. It consists of an electroless nickel plating covered with a thin layer of immersion gold, which protects the nickel from oxidation.
Immersion Silver (Iag)
It consists of thin immersion silver plating over the copper traces.
Immersion Tin
The immersion tin provides a consistently flat surface approximately 20-40 micro inches in thickness.
Organic Solderability Preservative (OSP)

Organic Solderability Preservative, or OSP is a method for plating printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and provides an organometallic layer that protects the copper during soldering.
Electronic Assembly Manufacturing Companies
ReplyDeleteEMS assembly services offered by electronic assembly manufacturing companies are tailored to assist organizations to save hugely on their time and resources.
Read full story: https://bit.ly/2YVUKAr